A*STAR Institute of Microelectronics (IME) has launched the 2.5D Through-Silicon Interposer (TSI) Consortium to accelerate market adoption of TSI technology, which is driven by strong demands in ...
A*STAR's Institute of Microelectronics (IME) and United Test and Assembly Center (UTAC), a leading outsourced assembly and test (OSAT) provider, have announced a collaboration to develop a 2.5D ...
As design and manufacturing issues with true 3D design continue to be worked out, interim 2.5D technologies are moving ahead as engineering teams leverage this packaging-driven approach to manage heat ...
SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced the immediate availability of its next-generation 2.5D ...
TOKYO--(BUSINESS WIRE)--USHIO INC., (TOKYO:6925) (President and CEO: Shiro Sugata) today announced that the company installed one unit of a projection aligner dedicated to developing 2.5D glass ...
Synopsys Fusion Design Platform and Custom Design Platform support 7LPP SoCs and SUB20LPIN silicon interposer Immediate foundry customer deployment through Samsung customized design flow Synopsys, Inc ...
2.5D and 3D Packaging Technology: The 2.5D and 3D packaging technologies encompass various packaging techniques. In 2.5D packaging, the choice of interposer material categorizes it into Si-based, ...
Semiconductor Engineering sat to discuss advanced packaging issues with Juan Rey, senior director of engineering for Calibre at Mentor Graphics; Max Min, senior technical manager at Samsung; and Lisa ...
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