A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.

In this paper, the authors study TSV-to-TSV coupling in 3D ICs. A full-chip SI analysis flow is proposed based on the proposed coupling model. Analysis results show that TSVs cause significant ...

The evolution of from SoCs and sensors onto 3D ICs is presenting quality and test challenges, according to James Quinn, VP of sales and marketing at Multitest. He outlined those challenges in a ...

“The next level of chip integration is rapidly evolving, and 3D IC technology is poised to enable the next frontier of IC capabilities for customers under various deployment models,” said Shim Il Kwon ...