As process nodes continue to advance into the sub-micron era, the limitations of traditional scaling are becoming increasingly evident. Larger monolithic chips are facing challenges such as higher ...

UMC's 3D IC solution for RFSOI reduces circuit footprint by more than 45%, enabling integration of more RF components in 5G-enabled devices. UMC's innovative 3D IC technology addresses the challenge ...

What’s 3D IC, and what’s causing the shift from 2D IC to 3D IC? How does this new technology relate to heterogeneous integration and advanced packaging? What is required for a successful 3D IC ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it is collaborating with TSMC to enhance productivity and optimize product performance for AI-driven ...

Leveraging years of stacked BSI sensor production, Tower’s wafer-scale 3D-IC technology unlocks integration of SiPho and EIC processes for emerging applications such as Co-Packaged Optics, including ...

Thermal challenges in 3D-IC designs can cause a significant risk in meeting performance specifications. While the pace of Moore’s Law has slowed in recent years, system technology co-optimization ...

Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology SAN JOSE, Calif.--(BUSINESS WIRE)-- Cadence (Nasdaq: CDNS) today announced it is ...

The Industrial Technology Research Institute (ITRI) has partnered with microcontroller unit (MCU) manufacturer Generalplus to develop a wireless oral sensing capsule for medical inspection services.

BeSang (Beaverton, OR), a semiconductor company, National NanoFab Center (NNFC), a nanotechnology laboratory, (Daejeon, Korea) and Stanford NanoFab (SNF) (Palo Alto, CA, a state-of-the-art, ...

Developing economies do not have to invest billions of dollars in state-of-the-art fabs to get into the semiconductor industry, according to Sadeg Faris, chairman and chief executive officer of Reveo ...