Intel has announced the industry's first Glass Core Substrate (GCS) technology for next-generation advanced packaging, which has once again attracted market discussion due to the recent AI trend. Save ...

SHENZHEN, China, Dec. 8, 2025 /PRNewswire/ -- PCBAIR announced the launch of its advanced 8-layer Glass Core PCB manufacturing capabilities, combining proprietary Through Glass Via (TGV) technology ...

As demand for artificial intelligence (AI) chips soars, volumes of server substrates are increasing, but the mood in Korea's printed circuit board (PCB) industry is muted. Even with high factory ...

One of [CNLohr]’s bigger claims to fame is his process for making glass PCBs. They’re pretty much identical to regular, fiberglass-based PCBs, but [CNLohr] is building circuits on microscope slides.

As electronic systems evolve toward RF transmission, optoelectronic integration, and miniaturization, glass PCBs have emerged as a promising alternative to overcome material performance bottlenecks.

Apple (AAPL) and Qualcomm (QCOM) are concerned about the strained supplies of Japan's high-end glass cloth fiber, Nikkei Asia ...

Designed for AI accelerators, high-speed data center servers, and optical transceivers, PCBAIR's 8-layer Glass Core PCBs support finer line widths and spacing, with pilot production and customer ...