SAN JOSE, Calif.--(BUSINESS WIRE)--Power Integrations™ (NASDAQ: POWI), the leader in high-voltage integrated circuits for energy-efficient power conversion, is providing advanced PowiGaN™ ...
A smart power-management IC recently rolled out by Nexperia can efficiently extract tiny amounts of power from energy sources such as light and vibration to run wireless sensors, wearables, and other ...
SUNNYVALE, Calif.--(BUSINESS WIRE)-- Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap ...
MILPITAS, Calif.--(BUSINESS WIRE)--On September 19, 2016, NuVolta Technologies Inc. announces that it has developed industry’s first 20W receiver IC based on its high efficiency Controlled Resonance ...
In the process of creating ICs, the digital implementation stage is focused on meeting the performance, power, and area (PPA) targets defined for the design. Traditionally, when talking about PPA ...
The LM25066 is a system power management and protection integrated circuit (IC) that combines a high performance hot-swap controller with a PMBus™ compliant SMBus/I2C interface to accurately measure, ...
Navitas Semiconductor has announced that its high-power GaNSafe ICs have achieved automotive qualification under the AEC-Q100 and AEC-Q101 standards, marking a significant advancement in gallium ...
The rise of global AI applications has driven increased demand for power ICs, with power management IC (PMIC) design company uPI Semiconductor reporting steady demand for integrated Power Stage and ...
As scaling at advanced nodes becomes increasingly constrained by cost, yield, and power density, semiconductor innovation is shifting decisively toward 3D-IC technologies, chiplets, and heterogeneous ...
Version 2.0b of AEi Systems’ Power IC Model Library for the Cadence PSpice simulator is now available from EMA Design Automation. Version 2.0b contains over 200 time-domain simulation models for power ...
Design engineers are increasingly turning to 3D ICs to keep pace with the ascent of next-generation AI scaling.
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