However, sTIMs cannot be used alone, they require backside metallization (BSM) on the module to establish a thermal path and adhesion between the lid, sTIM, and the module. Conventional BSM processing ...
Directional thermal diffusion and insulation of in-plane anisotropic carbon fiber/CNF nanocomposite films. In a new study, scientists from Japan designed flexible thermal diffusion films made of ...
High voltage power supplies (HVPS) for medical devices need stable, secure mounting methods and heat management.
All of this is prompting chip designers to explore new strategies to dial down the heat. These include using exotic materials like graphene and diamond, incorporating advanced packaging techniques ...
FOSHAN, GUANGDONG, CHINA, January 20, 2026 /EINPresswire.com/ -- The global aluminum extrusion market is witnessing a ...
In recent years, the space industry has experienced unprecedented explosive growth, with the number of satellite launches increasing exponentially. By the end of 2023, the number of global operational ...
Careful device selection and good thermal design practices can help optimize the performance of highly miniaturized dc-dc converters intended for mobile applications. User demands for high ...
(Nanowerk Spotlight) As electronics become smaller, faster and more powerful, managing the heat they generate is becoming increasingly challenging. Densely packed 3D electronics, made by stacking ...
Most materials have an inherent capacity to handle heat. Plastic, for instance, is typically a poor thermal conductor, whereas materials like marble move heat more efficiently. If you were to place ...
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